Figure 1 from Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

A study in flip-chip UBM/bump reliability with effects of SnPb

Effects of UBM structure/material on the reliability performance

Schematic diagram of the electromigration test sample.

a reliable wafer-level chip scale package (wlcsp) - AKRO Engineering

a reliable wafer-level chip scale package (wlcsp) - AKRO Engineering

A study in flip-chip UBM/bump reliability with effects of SnPb

Mixed mode cracking in a thermally cycled BGA. The interfacial

Solder Joint Technology

SEM images of the cracks in the unfailed solder joints after