At the University of Alberta, the Imaging Science Lab aims to develop vertically-integrated (VI) CMOS image sensors with capabilities that exceed those of conventional CMOS image sensors. VI-CMOS image sensors are examples of 3D electronics because they consist of photodetectors that are placed in a layer above standard CMOS circuits. Although metal lines commonly pass over transistors in CMOS image sensors, a distinguishing characteristic of VI-CMOS image sensors is the layering of semiconductor devices. The main advantage of vertical integration is that the different layers may be fabricated using different processes, each one optimized to best suit the type of devices it contains.
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Flipchip bonding.
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Study of Structure and Failure Mechanisms in ACA Interconnections
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Development of Flip Chip Bonding Process on Silicon Interposer by
